Air-cooling heat dissipation device and system

ABSTRACT

An air-cooling heat dissipation device is provided for removing heat from the electronic component. The air-cooling heat dissipation device includes a base and an air pump. The base includes a top surface, a bottom surface, two lateral walls, a guiding chamber, an introduction opening and plural discharge grooves. The two lateral walls are connected between the top surface and the bottom surface. The introduction opening is formed in the top surface. The guiding chamber runs through the bottom surface and is in communication with the introduction opening. The discharge grooves are formed in one of the lateral walls and in communication with the guiding chamber. The plural discharge grooves are oriented toward the electronic component, so that a lateral air flow generated by the air pump is discharged through the discharge grooves and passes the electronic component to remove heat therefrom.

FIELD OF THE INVENTION

The present invention relates to an air-cooling heat dissipation deviceand system. More particularly, it relates to an air-cooling heatdissipation device using an air pump to produce an air flow to removeheat and plural devices may be incorporated into a system.

BACKGROUND OF THE INVENTION

With increasing development of science and technology, the trends ofdesigning electronic devices such as portable computers, tabletcomputers, industrial computers, portable communication devices or videoplayers are designed toward minimization, easy portability and highperformance. Generally, the limited space inside the electronic deviceis equipped with various high-integration or high-power electroniccomponents for increasing the computing speed and the function of theelectronic device, thus generating a great deal of heat duringoperations. Consequently, the temperature inside the device is increasedand high temperature is harmful to the components. Since the electronicdevice is usually designed as possible as in slim, flat and succinctappearance, it has insufficient inner space for dissipating the wasteheat. In case that the heat is not effectively dissipated away, theelectronic components of the electronic device are adversely affected bythe heat and the high temperature may result in the interference ofoperation or damaged of the device.

Generally, there are two types of the heat-dissipating mechanisms usedin the electronic device to solve such problem, which are known asactive heat-dissipating mechanism and passive heat-dissipatingmechanism. The active heat-dissipating mechanism is usually presented asan axial fan or a blower, disposed within the electronic device, whichcan generate an air flow through the space inside the electronic devicethat dissipating the waste heat. However, the axial fan and the blowerare noisy during operation. In addition, they are bulky and have shortlife span and not suitable to be used in the small-sized, portableelectronic device.

On the other hand, electronic components are generally fixed on aprinted circuit board (PCB) by means of surface mount technology (SMT)or selective soldering technology. The electronic components wouldreadily come off from the PCB board due to exposure of high temperature.Moreover, most electronic components would be damaged by hightemperature. In other words, high temperature not only impairs thestability of performance of the electronic components, but also shortensthe life span of the electronic components.

FIG. 1 is a schematic view illustrating a conventional heat-dissipatingmechanism as the passive heat-dissipating mechanism. As shown in FIG. 1,the conventional heat-dissipating mechanism 1 provides a thermalconduction plate 12 attaching on a surface of an electronic component 11by thermal adhesive 13. Therefore, the thermal adhesive 13 and thethermal conduction plate 12 form a thermal conduction path by which thewaste heat generated by the electronic component 11 can be conductedaway and then dissipated by convection. However, the heat dissipatingefficiency of the conventional heat-dissipating mechanism 1 is usuallyinsufficient, and thus the applications of the conventionalheat-dissipating mechanism 1 are limited.

Therefore, there is a need of providing an air-cooling heat dissipationdevice and system with improved performance in order to overcome thedrawbacks of the conventional technologies.

SUMMARY OF THE INVENTION

An object of the present invention provides an air-cooling heatdissipation device and system for an electronic device to remove heatgenerated by electronic components thereof by means of lateral heatconvection. The use of the air-cooling heat dissipation device canincrease the heat dissipating efficiency and prevent generatingunacceptable noise. Consequently, the performance of the electroniccomponents of the electronic device is stabilized and the life spans ofthe electronic components are extended. Moreover, since it is notnecessary to attach a heat sink on the electronic component, the overallthickness of the electronic device is reduced.

Another object of the present invention provides an air-cooling heatdissipation device and an air-cooling heat dissipation system with atemperature controlling function. The operations of an air pump arecontrolled according to the temperature changes of the electroniccomponents of the electronic device. Consequently, the life span of theair pump is extended.

In accordance with an aspect of the present invention, an air-coolingheat dissipation device is located near an electronic component forremoving heat therefrom. The air-cooling heat dissipation deviceincludes a base and an air pump. The base includes a top surface, abottom surface, two lateral walls, a guiding chamber, an introductionopening and plural discharge grooves. The lateral walls are connectedbetween the top surface and the bottom surface. The introduction openingis formed in the top surface. The guiding chamber runs through thebottom surface and is in communication with the introduction opening.The pluraldischarge grooves are formed in one of the lateral wall s andin communication with the guiding chamber. The plural discharge groovesare oriented toward the electronic component. The air pump is disposedon the top surface of the base and sealing the edge of the introductionopening. When the air pump is enabled, an ambient air is driven by theair pump and introduced into the guiding chamber through theintroduction opening and then discharged through the plural dischargegrooves such that a lateral air flow is generated and passes over theelectronic component to remove the heat from the electronic component.

In accordance with another aspect of the present invention, anair-cooling heat dissipation system is provided. The air-cooling heatdissipation system includes plural air-cooling heat dissipation devices,and the air-cooling heat dissipation devices are located near theelectronic component.

The above contents of the present invention will become more readilyapparent to those ordinarily skilled in the art after reviewing thefollowing detailed description and accompanying drawings, in which:

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a schematic view illustrating a conventional heat-dissipatingmechanism;

FIG. 2A is a schematic perspective view illustrating the structure of anair-cooling heat dissipation device according to a first embodiment ofthe present invention;

FIG. 2B is a schematic cross-sectional view illustrating the air-coolingheat dissipation device of FIG. 2A and taken along the line AA;

FIG. 3A is a schematic perspective view illustrating a base of theair-cooling heat dissipation device as shown in FIG. 2A;

FIG. 3B is a schematic perspective view illustrating the base of FIG. 3Aand taken along another viewpoint;

FIG. 4 schematically illustrates the architecture of an air-cooling heatdissipation system according to an embodiment of the present invention;

FIG. 5A is a schematic exploded view illustrating an air pump used inthe air-cooling heat dissipation device of the present invention;

FIG. 5B is a schematic exploded view illustrating the air pump of FIG.5A and taken along another viewpoint;

FIG. 6 is a schematic cross-sectional view illustrating a piezoelectricactuator of the air pump as shown in FIGS. 5A and 5B;

FIG. 7 is a schematic cross-sectional view illustrating the air pump asshown in FIGS. 5A and 5B;

FIGS. 8A to 8E schematically illustrate the actions of the air pump ofFIGS. 5A and 5B; and

FIG. 9 is a schematic cross-sectional view illustrating an air-coolingheat dissipation device according to a second embodiment of the presentinvention.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENT

The present invention will now be described more specifically withreference to the following embodiments. It is to be noted that thefollowing descriptions of preferred embodiments of this invention arepresented herein for purpose of illustration and description only. It isnot intended to be exhaustive or to be limited to the precise formdisclosed.

FIG. 2A is a schematic perspective view illustrating the structure of anair-cooling heat dissipation device according to a first embodiment ofthe present invention. FIG. 2B is a schematic cross-sectional viewillustrating the air-cooling heat dissipation device of FIG. 2A andtaken along the line AA. FIG. 3A is a schematic perspective viewillustrating a base of the air-cooling heat dissipation device as shownin FIG. 2A. FIG. 3B is a schematic perspective view illustrating thebase of FIG. 3A and taken along another viewpoint.

Please refer to FIGS. 2A, 2B, 3A and 3B. The air-cooling heatdissipation device 2 is applied to an electronic device (not shown) toremove the heat generated by an electronic component 3 of the electronicdevice. An example of the electronic device includes but is not limitedto a portable computer, tablet computer, an industrial computer, aportable communication device or video player. The air-cooling heatdissipation device 2 comprises a base 20 and an air pump 22. The base 20comprises a top surface 20 a, a bottom surface 20 b, a guiding chamber200, an introduction opening 201, plural discharge grooves 203, and twolateral walls which are indicated as a first lateral wall 204 a and asecond lateral wall 204 b.

The top surface 20 a and the bottom surface 20 b are opposite to eachother, while the first lateral wall 204 a and the second lateral wall204 b are connected between the top surface 20 a and the bottom surface20 b. The guiding chamber 200 is enclosed by the top surface 20 a andthe lateral walls, and runs through the bottom surface 20 b. Theintroduction opening 201 is formed in the top surface 20 a and is incommunication with the guiding chamber 200.

In some embodiments, the air-cooling heat dissipation device 2 maycomprise a receiving part 202, which is a recess concavely formed in thetop surface 20 a of the base 20 and arranged around the introductionopening 201. The receiving part 202 is for the air pump 22 to beassembled with that can position the air pump 22 in a lower level. Insome other embodiments, the base 20 may not be equipped with thereceiving part 202. As so, the air pump 22 is assembled with the topsurface 20 a of the base 20 and sealing the edge of the introductionopening 201, and the efficiency of heat dissipation of the device is notaffected.

The plural discharge grooves 203 are formed in any one of the lateralwalls, which is exemplified by the second lateral wall 204 bhereinafter. The discharge grooves 203 provide access between theguiding chamber 200 and the exterior surroundings. The air pump 22 isassembled with the receiving part 202 of the base 20 and sealing theedge of the introduction opening 201. When the air pump 22 is enabled,the ambient air is driven by the air pump 22 and introduced into theguiding chamber 200 through the introduction opening 201, and quicklydischarged through the plural discharge grooves 203. Consequently, alateral air flow 205 is generated and passes over the electroniccomponent 3 in which heat exchange occurs.

In some embodiments, the air-cooling heat dissipation device 2 furthercomprises a supporting substrate 4, and the electronic component 3 isdisposed on the supporting substrate 4. Preferably but not exclusively,the supporting substrate 4 is a printed circuit board. A portion of thesupporting substrate 4 is connected to the bottom surface 20 b of thebase 20 to close the bottom side of the guiding chamber 200. That is,the base 20 is fixed on the supporting substrate 4 and located near theelectronic component 3. In the meantime, plural discharge openings 203 aof the plural discharge grooves 203 are oriented toward the electroniccomponent 3.

In some embodiments, the air pump 22 is a piezoelectric air pump. Theair pump 22 is fixed in the receiving part 202 of the base 20. Moreover,the air pump 22 is assembled with and sealing the edge of theintroduction opening 201. The base 20 is fixed by attaching the bottomsurface 20 b thereof on the supporting substrate 4. In other words, acombination of the base 20 and the air pump 22 covers and joins to aportion of the supporting substrate 4, while an electronic component 3is disposed on another portion of the supporting substrate 4 and islocated nearby. Meanwhile, the discharge grooves 203 are oriented towardthe electronic component 3. Since the introduction opening 201 is sealedby the air pump 22 and the bottom side of the guiding chamber 200 isenclosed by the supporting substrate 4, an enclosed passage is definedby the introduction opening 201, the guiding chamber 200 and the pluraldischarge grooves 203 collaboratively. The enclosed passage can guideand collect the introduced air to become a lateral air flow 205 thatremoving the heat from the electronic component 3, which enhances theheat dissipating efficiency. It is noted that numerous modifications andalterations may be made while retaining the teachings of the invention.The type of the passage may be varied according to the practicalrequirement, which means the passage is not limited to the enclosedtype.

The air pump 22 is operable to drive the external ambient air to becontinuously introduced into the guiding chamber 200 through theintroduction opening 201 and quickly discharged through the dischargegrooves 203. Consequently, a lateral air flow 205 is generated. Induration of the operation of the air pump, the lateral air flow 205keeps passing over the electronic component 3 and causes heat convectionaround the electronic component 3, which maintains transferring wasteheat generated by the electronic component 3 away. Thus, hightemperature of or around the electronic component 3 is prevented, andthe life span and stability of performance of the electronic component 3are increased. Moreover, the overall thickness of the air-cooling heatdissipation device is reduced.

FIG. 4 schematically illustrates the architecture of an air-cooling heatdissipation system according to an embodiment of the present invention.As shown in FIG. 4, the air-cooling heat dissipation system 5 comprisesplural air-cooling heat dissipation devices. For succinctness, only twoair-cooling heat dissipation devices 2′ and 2″ are shown. The twoair-cooling heat dissipation devices 2′ and 2″ are used to remove theheat from an electronic component 3. Components corresponding to thoseof the air-cooling heat dissipation device 2 of FIG. 2B are designatedby identical numeral references, and detailed descriptions thereof areomitted. In this embodiment, the two air-cooling heat dissipationdevices 2′ and 2″ of the air-cooling heat dissipation system 5 aredisposed on the supporting substrate 4 and respectively located by twoopposite sides of the electronic component 3. Moreover, the dischargegrooves 203 of the bases 20 of the two air-cooling heat dissipationdevices 2′ and 2″ are oriented toward the two opposite sides of theelectronic component 3 respectively. When the air pumps 22 of the twoair-cooling heat dissipation devices 2′ and 2″ are enabled, the ambientair is introduced into the guiding chambers 200 through the introductionopenings 201 and quickly discharged through the discharge grooves 203 ofthe air-cooling heat dissipation devices 2′ and 2″. Consequently, twolateral air flows 205 in reverse directions are generated and both passover the electronic component 3, thus causing convection around theelectronic component 3 that removing heat therefrom. As a result, hightemperature of or around the electronic component 3 is prevented, andthe life span and stability of performance of the electronic component 3are increased. It is noted that the number of the air-cooling heatdissipation devices of the air-cooling heat dissipation system may bevaried according to the practical requirements.

FIG. 5A is a schematic exploded view illustrating an air pump used inthe air-cooling heat dissipation device according to an embodiment ofthe present invention. FIG. 5B is a schematic exploded view illustratingthe air pump of FIG. 5A and taken along another viewpoint. FIG. 6 is aschematic cross-sectional view illustrating a piezoelectric actuator ofthe air pump as shown in FIGS. 5A and 5B. FIG. 7 is a schematiccross-sectional view illustrating the air pump as shown in FIGS. 5A and5B. Please refer to FIGS. 5A, 5B, 6 and 7. According to an embodiment ofthe present invention, the air pump 22 is a piezoelectric air pump,comprising a gas inlet plate 221, a resonance plate 222, a piezoelectricactuator 223, a first insulation plate 2241, a conducting plate 225 anda second insulation plate 2242, which are stacked on each othersequentially. The piezoelectric actuator 223 is aligned with theresonance plate 222. After the above components are combined together,the cross-sectional view of the resulting structure of the air pump 22is shown in FIG. 7.

The gas inlet plate 221 comprises at least one inlet 221 a. Preferablybut not exclusively, the gas inlet plate 221 comprises four inlets 221a. The inlets 221 a run through the gas inlet plate 221. In response tothe action of the atmospheric pressure, the air is introduced into theair pump 22 through the inlets 221 a. Moreover, at least one convergencechannel 221 b is formed on a first surface of the gas inlet plate 221,and is in communication with the at least one inlet 221 a on a secondsurface of the gas inlet plate 22. Moreover, a central cavity 221 c islocated at the intersection of the four convergence channels 221 b. Thecentral cavity 221 c is in communication with the at least oneconvergence channel 221 b, such that the gas entered by the inlets 221 awould be introduced into the at least one convergence channel 221 b andis guided to the central cavity 221 c. Consequently, the air can betransferred by the air pump 22. In this embodiment, the at least oneinlet 221 a, the at least one convergence channel 221 b and the centralcavity 221 c of the gas inlet plate 221 are integrally formed. Thecentral cavity 221 c is a convergence chamber for temporarily storingthe air. Preferably but not exclusively, the gas inlet plate 221 is madeof stainless steel. In some embodiments, the depth of the convergencechamber defined by the central cavity 221 c is equal to the depth of theat least one convergence channel 221 b. The resonance plate 222 is madeof a flexible material, which is preferably but not exclusively copper.The resonance plate 222 further has a central aperture 2220corresponding to the central cavity 221 c of the gas inlet plate 221that providing the gas for flowing through.

The piezoelectric actuator 223 comprises a suspension plate 2231, anouter frame 2232, at least one bracket 2233 and a piezoelectric plate2234. The piezoelectric plate 2234 is attached on a first surface 2231 cof the suspension plate 2231. In response to an applied voltage, thepiezoelectric plate 2234 would be subjected to a deformation. When thepiezoelectric plate 2233 is subjected to the deformation, the suspensionplate 2231 is subjected to a curvy vibration. The at least one bracket2233 is connected between the suspension plate 2231 and the outer frame2232, while the two ends of the bracket 2233 are connected with theouter frame 2232 and the suspension plate 2231 respectively that thebracket 2233 can elastically support the suspension plate 2231. At leastone vacant space 2235 is formed between the bracket 2233, the suspensionplate 2231 and the outer frame 2232. The at least one vacant space 2235is in communication with the introduction opening 201 for allowing theair to go through. The type of the suspension plate 2231 and the outerframe 2232, and the type and the number of the at least one bracket 2233may be varied according to the practical requirements. The outer frame2232 is arranged around the suspension plate 2231. Moreover, aconducting pin 2232 c is protruding outwardly from the outer frame 2232so as to be electrically connected with an external circuit (not shown).

As shown in FIG. 6, the suspension plate 2231 has a bulge 2231 a thatmakes the suspension plate 2231 a stepped structure. The bulge 2231 a isformed on a second surface 2231 b of the suspension plate 2231. Thebulge 2231 b may be a circular convex structure. A top surface of thebulge 2231 a of the suspension plate 2231 is coplanar with a secondsurface 2232 a of the outer frame 2232, while the second surface 2231 bof the suspension plate 2231 is coplanar with a second surface 2233 a ofthe bracket 2233. Moreover, there is a drop of specified amount from thebulge 2231 a of the suspension plate 2231 (or the second surface 2232 aof the outer frame 2232) to the second surface 2231 b of the suspensionplate 2231 (or the second surface 2233 a of the bracket 2233). A firstsurface 2231 c of the suspension plate 2231, a first surface 2232 b ofthe outer frame 2232 and a first surface 2233 b of the bracket 2233 arecoplanar with each other. The piezoelectric plate 2234 is attached onthe first surface 2231 c of the suspension plate 2231. The suspensionplate 2231 may be a square plate structure with two flat surfaces butthe type of the suspension plate 2231 may be varied according to thepractical requirements. In this embodiment, the suspension plate 2231,the at least bracket 2233 and the outer frame 2232 are integrally formedand produced by using a metal plate (e.g., a stainless steel plate). Inan embodiment, the length of the piezoelectric plate 2234 is smallerthan the length of the suspension plate 2231. In another embodiment, thelength of the piezoelectric plate 2234 is equal to the length of thesuspension plate 2231. Similarly, the piezoelectric plate 2234 is asquare plate structure corresponding to the suspension plate 2231.

In the air pump 22, the first insulation plate 2241, the conductingplate 225 and the second insulation plate 2242 are stacked on each othersequentially and located under the piezoelectric actuator 223. Theprofiles of the first insulation plate 2241, the conducting plate 225and the second insulation plate 2242 substantially match the profile ofthe outer frame 2232 of the piezoelectric actuator 223. The firstinsulation plate 2241 and the second insulation plate 2242 are made ofan insulating material (e.g. a plastic material) for providinginsulating efficacy. The conducting plate 225 is made of an electricallyconductive material (e.g. a metallic material) for providingelectrically conducting efficacy. Moreover, the conducting plate 225 hasa conducting pin 225 a so as to be electrically connected with anexternal circuit (not shown).

In an embodiment, the gas inlet plate 221, the resonance plate 222, thepiezoelectric actuator 223, the first insulation plate 2241, theconducting plate 225 and the second insulation plate 2242 of the airpump 22 are stacked on each other sequentially. Moreover, there is a gaph between the resonance plate 222 and the outer frame 2232 of thepiezoelectric actuator 223, which is formed and maintained by a filler(e.g. a conductive adhesive) inserted therein in this embodiment. Thegap h ensures the proper distance between the bulge 2231 a of thesuspension plate 2231 and the resonance plate 222, so that the contactinterference is reduced and the generated noise is largely reduced. Insome embodiments, the height of the outer frame 2232 of thepiezoelectric actuator 223 is increased, so that the gap is formedbetween the resonance plate 222 and the piezoelectric actuator 223.

After the gas inlet plate 221, the resonance plate 222 and thepiezoelectric actuator 223 are combined together, a movable part 222 aand a fixed part 222 b of the resonance plate 222 are defined. Aconvergence chamber for converging the air is defined by the movablepart 222 a of the resonance plate 222 and the gas inlet plate 211collaboratively. Moreover, a first chamber 220 is formed between theresonance plate 222 and the piezoelectric actuator 223 for temporarilystoring the air. Through the central aperture 2220 of the resonanceplate 222, the first chamber 220 is in communication with the centralcavity 221 c of the gas inlet plate 221. The peripheral regions of thefirst chamber 220 are in communication with the underlying introductionopening 201 through the vacant space 2235 between the brackets 2233 ofthe piezoelectric actuator 223.

FIGS. 8A to 8E schematically illustrate the actions of the air pump ofFIGS. 5A and 5B. Please refer to FIGS. 7 and 8A to 8E. The actions ofthe air pump will be described as follows. When the air pump 22 isenabled, the piezoelectric actuator 223 is vibrated along a verticaldirection in a reciprocating manner by using the bracket 2233 as thefulcrums. The resonance plate 222 except for the part of it fixed on thegas inlet plate 221 is hereinafter referred as a movable part 222 a,while the rest is referred as a fixed part 222 b. Since the resonanceplate 222 is light and thin, the movable part 222 a vibrates along withthe piezoelectric actuator 223 because of the resonance of thepiezoelectric actuator 223. In other words, the movable part 222 a isreciprocated and subjected to a curvy deformation. When thepiezoelectric actuator 223 is vibrated downwardly, the movable part 222a of the resonance plate 222 is subjected to the curvy deformationbecause the movable part 222 a of the resonance plate 222 is pushed bythe air and vibrated in response to the piezoelectric actuator 223. Inresponse to the downward vibration of the piezoelectric actuator 223,the air is fed into the at least one inlet 221 a of the gas inlet plate221. Then, the air is transferred to the central cavity 221 c of the gasinlet plate 221 through the at least one convergence channel 221 b.Then, the air is transferred through the central aperture 2220 of theresonance plate 222 corresponding to the central cavity 221 c, andintroduced downwardly into the first chamber 220. As the piezoelectricactuator 223 is enabled, the resonance of the resonance plate 222occurs. Consequently, the resonance plate 222 is also vibrated along thevertical direction in the reciprocating manner.

As shown in FIG. 8B, during the vibration of the movable part 222 a ofthe resonance plate 222, the movable part 222 a moves down till bringcontacted with the bulge 2231 a of the suspension plate 2231. In themeantime, the volume of the first chamber 220 is shrunken and a middlespace which was communicating with the convergence chamber is closed.Under this circumstance, the pressure gradient occurs to push the air inthe first chamber 121 moving toward peripheral regions of the firstchamber 220 and flowing downwardly through the vacant spaces 2235 of thepiezoelectric actuator 223.

Please refer to FIG. 8C, which illustrates consecutive action followingthe action in FIG. 8B. The movable part 222 a of the resonance plate 222has returned its original position when, the piezoelectric actuator 223has ascended at a vibration displacement to an upward position.Consequently, the volume of the first chamber 220 is consecutivelyshrunken that generating the pressure gradient which makes the air inthe first chamber 220 continuously pushed toward peripheral regions.Meanwhile, the air continuously fed into the inlets 221 a of the gasinlet plate 221 and transferred to the central cavity 221 c.

Then, as shown in FIG. 8D, the resonance plate 222 moves upwardly, whichis caused by the resonance of the upward motion of the piezoelectricactuator 223. Consequently, the air is slowly fed into the inlets 221 aof the gas inlet plate 221, and transferred to the central cavity 221 c.

As shown in FIG. 8E, the movable part 222 a of the resonance plate 222has returned its original position. When the resonance plate 222 isvibrated along the vertical direction in the reciprocating manner, thegap h between the resonance plate 222 and the piezoelectric actuator 223providing space for vibration of the resonance plate 222. That is, thethickness of the gap h affects the amplitude of vibration of theresonance plate 12. Consequently, a pressure gradient is generated inthe fluid channels of the air pump 22 to facilitate the air to flow at ahigh speed. Moreover, since there is an impedance difference between thefeeding direction and the exiting direction, the air can be transmittedfrom the inlet side to the outlet side. Moreover, even if the outletside has a gas pressure, the air pump 22 still has the capability ofpushing the air to the first guiding chamber 200 while achieving thesilent efficacy.

The steps of FIGS. 8A to 8E are repeatedly done. Consequently, theambient air is transferred by the air pump 22 from the outside to theinside.

As mentioned above, the operation of the air pump 22 can guide the airinto the guiding chamber 200 of the base 20 and quickly exhaust the airto the surroundings of the air-cooling heat dissipation device throughthe discharge grooves 203. Consequently, the lateral air flow 205 isgenerated and passes over the electronic component 3, and the lateralair flow 205 and the ambient air flow result in convection to removeheat from the electronic component 3. The heated air flow is quicklydissipated away from the electronic component 3 through convection, andthus the heat dissipation of the electronic component 3 is achieved, theperformance stability and the life span of the electronic component 3are increased.

FIG. 9 is a schematic cross-sectional view illustrating an air-coolingheat dissipation device according to a second embodiment of the presentinvention. Components corresponding to those of the first embodiment aredesignated by identical numeral references, and detailed descriptionsthereof are omitted. In comparison with the air-cooling heat dissipationdevice 2 of FIG. 2B, the air-cooling heat dissipation device 2 a of thisembodiment further provides a temperature controlling function.According to this embodiment, the air-cooling heat dissipation device 2a further comprises a control system 21 composed of a control unit 211and a temperature sensor 212. The control unit 211 is electricallyconnected with the air pump 22 to control the operation of the air pump22. The temperature sensor 212 may be directly attached on theelectronic component 3 so as to detect the temperature thereof.Alternatively, the temperature sensor 212 may be disposed on thesupporting substrate 4 and located near the electronic component 3 so asto detect ambient temperature of the electronic component 3. Thetemperature sensor 212 is electrically connected with the control unit211 to which the detected temperature as a detecting signal istransmitted. After receiving the detecting signal, the control unit 211determines whether the detected temperature is higher than apre-determined threshold value. If the detected temperature isdetermined higher than or equal to the threshold value, the control unit211 enables the air pump 22; oppositely, if the detected temperature isdetermined lower than the threshold value, the control unit 211 disablesthe air pump 22. As so, the air pump 22 operates only when hightemperature is detected, thus the life span of the air pump 22 can beprolonged.

From the above descriptions, the present invention provides anair-cooling heat dissipation device and a system comprising a pluralityof the air-cooling heat dissipation devices. The air-cooling heatdissipation device of the present invention has compact size that aresuitable to be applied to a wide variety of portable electronic devicesto remove heat generated by electronic components thereof throughlateral convection as well as keeping the electronic devices in slimprofile. Moreover, the heat is dissipated away more efficiently and thenoise during operation is reduced in comparison of the conventionaltechniques.

While the invention has been described in terms of what is presentlyconsidered to be the most practical and preferred embodiments, it is tobe understood that the invention needs not be limited to the disclosedembodiment. On the contrary, it is intended to cover variousmodifications and similar arrangements included within the spirit andscope of the appended claims which are to be accorded with the broadestinterpretation so as to encompass all such modifications and similarstructures.

What is claimed is:
 1. An air-cooling heat dissipation device locatednear an electronic component for removing heat therefrom, theair-cooling heat dissipation device comprising: a base comprising: a topsurface; a bottom surface opposing to the top surface; two lateral wallsconnected between the top surface and the bottom surface; anintroduction opening formed in the top surface; a guiding chamberrunning through the bottom surface and in communication with theintroduction opening; and plural discharge grooves formed in one of thelateral walls and in communication with the guiding chamber and orientedtoward the electronic component; an air pump disposed on the top surfaceof the base and sealing the edge of the introduction opening; and asupporting substrate, wherein a portion of the supporting substrate isconnected to the bottom surface of the base to close a bottom side ofthe guiding chamber, and the electronic component is supported on thesupporting substrate, wherein when the air pump is enabled, an ambientair is introduced into the guiding chamber through the introductionopening and is discharged through the plural discharge grooves such thata lateral air flow is generated and passes over the electronic componentto remove heat therefrom.
 2. The air-cooling heat dissipation deviceaccording to claim 1, wherein the base further comprises a receivingpart, wherein the receiving part is a recess that is concavely formed inthe top surface of the base and arranged around the introductionopening, and the air pump is assembled with the receiving part.
 3. Theair-cooling heat dissipation device according to claim 1, wherein theair pump is a piezoelectric air pump.
 4. The air-cooling heatdissipation device according to claim 3, wherein the piezoelectric airpump comprises: a gas inlet plate comprising at least one inlet, atleast one convergence channel and a central cavity, wherein aconvergence chamber is defined by the central cavity, and the at leastone convergence channel corresponds to the at least one inlet, whereinafter the air is introduced into the at least one convergence channelthrough the at least one inlet, the air is guided by the at least oneconvergence channel and converged to the convergence chamber; aresonance plate having a central aperture, wherein the central apertureis aligned with the convergence chamber, wherein the resonance platecomprises a movable part near the central aperture; and a piezoelectricactuator aligned with the resonance plate, wherein a gap is formedbetween the resonance plate and the piezoelectric actuator to define afirst chamber, wherein when the piezoelectric actuator is enabled, theair is fed into the air pump through the at least one inlet of the gasinlet plate, converged to the central cavity through the at least oneconvergence channel, transferred through the central aperture of theresonance plate, and introduced into the first chamber, wherein the airis further transferred through a resonance between the piezoelectricactuator and the movable part of the resonance plate.
 5. The air-coolingheat dissipation device according to claim 4, wherein the piezoelectricactuator comprises: a suspension plate having a first surface and anopposing second surface, wherein the suspension plate is permitted toundergo a curvy vibration; an outer frame arranged around the suspensionplate; at least one bracket connected between the suspension plate andthe outer frame for elastically supporting the suspension plate; and apiezoelectric plate, wherein a length of the piezoelectric plate issmaller than or equal to a length of the suspension plate, and thepiezoelectric plate is attached on the first surface of the suspensionplate, wherein when a voltage is applied to the piezoelectric plate, thesuspension plate is driven to undergo the curvy vibration.
 6. Theair-cooling heat dissipation device according to claim 5, wherein thesuspension plate is a square suspension plate having a bulge formed onthe second surface thereof.
 7. The air-cooling heat dissipation deviceaccording to claim 4, wherein the piezoelectric air pump furthercomprises a conducting plate, a first insulation plate and a secondinsulation plate, wherein the gas inlet plate, the resonance plate, thefirst insulation plate, the conducting plate and the second insulationplate are stacked on each other sequentially.
 8. The air-cooling heatdissipation device according to claim 1, further comprising a controlsystem, wherein the control system comprises: a control unitelectrically connected with the air pump for controlling operations ofthe air pump; and a temperature sensor electrically connected with thecontrol unit and located near the electronic component, wherein thetemperature sensor detects a temperature of the electronic component andgenerates a corresponding detecting signal to the control unit, whereinthe control unit obtains the temperature of the electronic componentaccording to the detecting signal, wherein if the control unitdetermines the temperature of the electronic component is higher than orequal to a threshold value, the control unit enables the air pump togenerate the lateral air flow, wherein if the control unit determinesthe temperature of the electronic component is lower than the thresholdvalue, the control unit disables the air pump.
 9. An air-cooling heatdissipation system for removing heat from an electronic component, theair-cooling heat dissipation system comprising plural air-cooling heatdissipation devices which are located near the electronic component,wherein each of the plural air-cooling heat dissipation devicescomprises: a base comprising: a top surface; a bottom surface opposingto the top surface; two lateral walls connected between the top surfaceand the bottom surface; an introduction opening formed in the topsurface; a guiding chamber running through the bottom surface and incommunication with the introduction opening; and plural dischargegrooves formed in one of the lateral walls and in communication with theguiding chamber and oriented toward the electronic component; an airpump disposed on the top surface of the base and sealing the edge of theintroduction opening; and a supporting substrate, wherein a portion ofthe supporting substrate is connected to the bottom surface of the baseto close a bottom side of the guiding chamber, and the electroniccomponent is supported on the supporting substrate, wherein when the airpump is enabled, an ambient air is introduced into the guiding chamberthrough the introduction opening and is discharged through the pluraldischarge grooves such that a lateral air flow is generated and passesover passes over the electronic component to remove heat therefrom.